Principal Characterization-Failure Analysis Engineer
Description
PsiQuantum’s mission is to build the first useful quantum computers—machines capable of delivering the breakthroughs the field has long promised. Since our founding in 2016, our singular focus has been to build and deploy million-qubit, fault-tolerant quantum systems. Quantum computers harness the laws of quantum mechanics to solve problems that even the most advanced supercomputers or AI systems will never reach. Their impact will span energy, pharmaceuticals, finance, agriculture, transportation, materials, and other foundational industries. Our architecture and approach is based on silicon photonics. By leveraging the advanced semiconductor manufacturing industry—including partners like GlobalFoundries—we use the same high-volume processes that already produce billions of chips for telecom and consumer electronics. Photonics offers natural advantages for scale: photons don’t feel heat, are immune to electromagnetic interference, and integrate with existing cryogenic cooling and standard fiber-optic infrastructure. In 2024, PsiQuantum announced government-funded projects to support the build-out of our first utility-scale quantum computers in Brisbane, Australia, and Chicago, Illinois. These initiatives reflect a growing recognition that quantum computing will be strategically and economically defining—and that now is the time to scale. PsiQuantum also develops the algorithms and software needed to make these systems commercially valuable. Our application, software, and industry teams work directly with leading Fortune 500 companies—including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical—to prepare quantum solutions for real-world impact. Quantum computing is not an extension of classical computing. It represents a fundamental shift—and a path to mastering challenges that cannot be solved any other way. The potential is enormous, and we have a clear path to make it real. Come join us. Job Summary: The Principal Characterization-Failure Analysis Engineer will be responsible for thermomechanical characterization of sub-assembly and associated silicon dies, as well as carrying out failure analysis/debug activities on sub-assemblies. This role requires engineering expertise in mechanical, thermal, packaging, and package-processing disciplines. Having peripheral experience in photonics and electrical engineering will be a plus. Responsibilities: - Experienced problem-solver and able to diagnose failures using root cause analysis tools such as fishbone diagram, hypothesis table, and 8D approach. - Experienced with failure mode and effects analysis (FMEA). - Experienced in data processing tools such as Python, MATLAB, and JMP. - Familiarity with back-end semiconductor assembly processes, testing methodologies, and equipment, including die attach, wire-bonding, and AOI. - Exposure to photonics sub-assembly with experience in semiconductor packaging and inspection equipment, processes, and material systems (die attach, wire bonding, optical coupling, flip chip, underfill, etc.). - Characterization experience in mechanical vibrations, thermography, and mechanical load testers. - Demonstrated ability to manage short deadlines and to follow a disciplined work process. Able to work in a fast-paced environment. <li da